What is the current 3D IC Packaging Market size?

The 3D IC Packaging Market is projected to register a CAGR of 16.80% during the forecast period (2024-2029) Read More

Who are the key players in 3D IC Packaging Market?

Taiwan Semiconductor Manufacturing Company, Samsung Electronics Co., Ltd., Intel Corporation, ASE Technology Holding Co., Ltd. and Amkor Technology are the major companies operating in the 3D IC Packaging Market. Read More

Which is the fastest growing region in 3D IC Packaging Market?

Asia-Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in 3D IC Packaging Market?

In 2024, the North America accounts for the largest market share in 3D IC Packaging Market. Read More

What years does this 3D IC Packaging Market cover?

The report covers the 3D IC Packaging Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the 3D IC Packaging Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

3D IC Packaging Market - Size, Share & Research

3D IC Packaging Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

The Global 3D IC Packaging Market is segmented by Packaging Technology (3D wafer-level chip-scale packaging (WLCSP), 3D TSV), by End-User (Consumer Electronics, Aerospace and Defense, Medical Devices, Communications and Telecom, Automotive), and Geography.

3D IC Packaging Industry Overview

The Global 3D IC Packaging Market is fragmented due to the presence of significant players such as Amkor Technology Inc., ASE Group, and Siliconware Precision Industries Co. Ltd (SPIL), among others. The market players must constantly innovate advanced and comprehensive products to stay relevant.

In May 2021: Intel plans to invest USD 3.5 billion to upgrade its Rio Rancho plant and increase its headcount by more than 35% at the sprawling complex, one of its three largest US manufacturing hubs. It is expanding its New Mexico operations to manufacture new generations of chips based on its Foveros 3D packaging technology, which could aid the company's attempts to regain its leadership status in the semiconductor industry.