How big is the 3D TSV And 2.5D Market?

The 3D TSV And 2.5D Market size is expected to reach USD 46.06 billion in 2024 and grow at a CAGR of 30.10% to reach USD 223.33 billion by 2029. Read More

What is the current 3D TSV And 2.5D Market size?

In 2024, the 3D TSV And 2.5D Market size is expected to reach USD 46.06 billion. Read More

Who are the key players in 3D TSV And 2.5D Market?

Toshiba Corp., Samsung Electronics Co. Ltd, ASE Group, Taiwan Semiconductor Manufacturing Company Limited and Amkor Technology, Inc. are the major companies operating in the 3D TSV And 2.5D Market. Read More

Which is the fastest growing region in 3D TSV And 2.5D Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in 3D TSV And 2.5D Market?

In 2024, the North America accounts for the largest market share in 3D TSV And 2.5D Market. Read More

What years does this 3D TSV And 2.5D Market cover, and what was the market size in 2023?

In 2023, the 3D TSV And 2.5D Market size was estimated at USD 35.40 billion. The report covers the 3D TSV And 2.5D Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the 3D TSV And 2.5D Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

3D TSV & 2.5D Market - Size, Share & Industry Analysis

3D TSV & 2.5D Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

Global 3D TSV And 2.5D Market is segmented by packaging type (3D stacked memory, 2.5D interposer, CIS with TSV, 3D SoC), end-user application (consumer electronics, automotive, high-performance computing (HPC), and networking), and geography (North America, Europe, Asia-Pacific, and Rest of the World). The market sizes and forecasts are provided in terms of value in USD for all the above segments.

3D TSV And 2.5D Industry Overview

The 3D TSV and 2.5D market is highly competitive and consists of various significant performers as it is diversified. The existence of small, large, and local vendors in the Market creates excellent competition. These firms leverage strategic collaborative endeavors to expand their market share and increase profitability. The companies in the Market are also acquiring start-ups performing on enterprise network equipment technologies to strengthen their product capabilities.

In August 2022, Intel showcased the unique architectural and packaging breakthroughs that help 2.5D and 3D-based chip designs, ushering in a remarkable era in chipmaking technologies and their importance. Intel's system foundry model features enhanced packaging. The organization intends to improve the number of transistors on a package from 100 billion to 1 trillion by 2030.

In March 2022, Apple adopted a 2.5D approach to boost the enactment of its latest M1 Ultra device that unlocks the door to future designs utilizing chiplets. A packaging architecture called UltraFusion interconnects the die of two M1 Max chips on a silicon interposer to build a system on a chip (SoC) with 114bn transistors. This utilizes a silicon substrate and interposer that supports the two dies with 10,000 interconnects with 2.5 TB/s of low latency and inter-processor bandwidth between the die. This also connects the die to 128 GB of low-latency unified memory operating an 800 GB/s interface.