How big is the Advanced IC Substrates Market?

The Advanced IC Substrates Market size is expected to reach USD 18.11 billion in 2024 and grow at a CAGR of 11.73% to reach USD 31.54 billion by 2029. Read More

What is the current Advanced IC Substrates Market size?

In 2024, the Advanced IC Substrates Market size is expected to reach USD 18.11 billion. Read More

Who are the key players in Advanced IC Substrates Market?

ASE Kaohsiung (ASE Inc.), AT&S Austria Technologies & Systemtechnik AG, Siliconware Precision Industries Co. Ltd, TTM Technologies Inc. and Ibiden Co. Ltd are the major companies operating in the Advanced IC Substrates Market. Read More

Which is the fastest growing region in Advanced IC Substrates Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in Advanced IC Substrates Market?

In 2024, the Asia Pacific accounts for the largest market share in Advanced IC Substrates Market. Read More

What years does this Advanced IC Substrates Market cover, and what was the market size in 2023?

In 2023, the Advanced IC Substrates Market size was estimated at USD 15.99 billion. The report covers the Advanced IC Substrates Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the Advanced IC Substrates Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

Advanced IC Substrates Market Analysis | Industry Report, Size & Forecast

Advanced IC Substrate Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

The Report Covers IC Substrate Manufacturers and the Market is Segmented by Type (FC BGA and FC CSP), Application (mobile and Consumer, Automotive and Transportation, IT and Telecom), and Geography (United States, China, Japan, South Korea, Taiwan, and the Rest of the World). The Report Offers Market Forecasts and Size in Value (USD) for all the Above Segments.

Advanced IC Substrate Industry Overview

The advanced IC substrates market is moderately competitive and consists of a few major players. The players dominating the market are ASE Group, TTM Technologies Inc., Kyocera Corporation, Siliconware Precision Industries Co. Ltd., and Ibiden Co. Ltd. The existing players in the market are striving to maintain a competitive edge by catering to newer technologies such as 5G telecommunication, high-performance data centers, compact electronic devices, etc.

In February 2023, South Korea-based LG Innotek announced that it acclerated its business activities on a full scale to target the Flip-Chip Ball Grid Array (FC-BGA) substrate market. The company recently unveiled the latest FC-BGA for the first time at 'CES 2023'. For the development of FC-BGA, the company is actively utilizing technologies such as the ultra-fine circuit, high-integration array, high-multi-layer substrate matching, and coreless technologies.

In January 2023, LG Innotek celebrated at the brand-new Gumi plant, which will manufacture FC-BGA. LG Innotek is building the newest FC-BGA production lines in the Gumi No. 4 factory, which was purchased in June 2022 and had a total gross area of about 220,000 square meters. Innotek LG intends to accelerate the development of FC-BGA. By the first half of this year, the new plant is expected to have a sophisticated production system in place, and in the second half of 2023, full-scale production will begin.