Market Share of Advanced IC Substrates Industry
The advanced IC substrates market is moderately competitive and consists of a few major players. The players dominating the market are ASE Group, TTM Technologies Inc., Kyocera Corporation, Siliconware Precision Industries Co. Ltd., and Ibiden Co. Ltd. The existing players in the market are striving to maintain a competitive edge by catering to newer technologies such as 5G telecommunication, high-performance data centers, compact electronic devices, etc.
In February 2023, South Korea-based LG Innotek announced that it acclerated its business activities on a full scale to target the Flip-Chip Ball Grid Array (FC-BGA) substrate market. The company recently unveiled the latest FC-BGA for the first time at 'CES 2023'. For the development of FC-BGA, the company is actively utilizing technologies such as the ultra-fine circuit, high-integration array, high-multi-layer substrate matching, and coreless technologies.
In January 2023, LG Innotek celebrated at the brand-new Gumi plant, which will manufacture FC-BGA. LG Innotek is building the newest FC-BGA production lines in the Gumi No. 4 factory, which was purchased in June 2022 and had a total gross area of about 220,000 square meters. Innotek LG intends to accelerate the development of FC-BGA. By the first half of this year, the new plant is expected to have a sophisticated production system in place, and in the second half of 2023, full-scale production will begin.
Advanced IC Substrate Market Leaders
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ASE Kaohsiung (ASE Inc.)
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AT&S Austria Technologies & Systemtechnik AG
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Siliconware Precision Industries Co. Ltd
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TTM Technologies Inc.
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Ibiden Co. Ltd
*Disclaimer: Major Players sorted in no particular order
