How big is the Advanced Packaging Market?

The Advanced Packaging Market size is expected to reach USD 32.64 billion in 2024 and grow at a CAGR of 6.63% to reach USD 45 billion by 2029. Read More

What is the current Advanced Packaging Market size?

In 2024, the Advanced Packaging Market size is expected to reach USD 32.64 billion. Read More

Who are the key players in Advanced Packaging Market?

Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, Advanced Semiconductor Engineering Inc., Intel Corporation and JCET Group Co. Ltd are the major companies operating in the Advanced Packaging Market. Read More

Which is the fastest growing region in Advanced Packaging Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in Advanced Packaging Market?

In 2024, the Asia Pacific accounts for the largest market share in Advanced Packaging Market. Read More

What years does this Advanced Packaging Market cover, and what was the market size in 2023?

In 2023, the Advanced Packaging Market size was estimated at USD 30.48 billion. The report covers the Advanced Packaging Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the Advanced Packaging Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

Advanced Packaging Market

Advanced Packaging Market Size - Industry Report on Share, Growth Trends & Forecasts Analysis (2024 - 2029)

The Advanced Packaging Technologies Market is Segmented by Packaging Platform (Flip Chip, Embedded Die, Fi-WLP, Fo-WLP, and 2. 5D/3D) and by Geography (North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa). The Report Offers Market Forecasts and Size in Value (USD) for all the Above Segments.

Advanced Packaging Industry Overview

The Advanced Packaging Market had a semi-consolidated landscape with key players like Advanced Semiconductor Engineering Inc., Taiwan Semiconductor Manufacturing Company Limited, Amkor Technology, Intel Corporation, and JCET Group Co. Ltd. A significant shift was noted as numerous IC manufacturers transitioned to sub-advanced packaging, spurring market demand and heightening competition.

In July 2023 - Amkor Technology extensively detailed its efforts and achievements in developing and validating wire bond and flip chip packaging for devices manufactured using TSMC's advanced low-k process technologies. Collaborating with multiple clients on low-k product qualification, Amkor aimed for a substantial volume ramp-up in low-k packages during the latter half of the year.
In November 2022 - Intel Corporation commenced work on a new semiconductor assembly and testing facility in Penang. Comprising two buildings (Plants 4 and 5) totaling 982,000 square feet within the Bayan Lepas Free Industrial Zone, this facility, expected to be finalized by 2025, was anticipated to generate 2,700 job opportunities within the local market.