What is the current APAC Die Attach Equipment Market size?

The APAC Die Attach Equipment Market is projected to register a CAGR of 15.30% during the forecast period (2024-2029) Read More

Who are the key players in APAC Die Attach Equipment Market?

Palomar Technologies, Inc., Shinkawa Ltd., Panasonic Corporation, ASM Pacific Technology Limited and Be Semiconductor Industries N.V. are the major companies operating in the APAC Die Attach Equipment Market. Read More

What years does this APAC Die Attach Equipment Market cover?

The report covers the APAC Die Attach Equipment Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the APAC Die Attach Equipment Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

APAC Die Attach Equipment Market Size & Share Analysis - Industry Research Report

Asia-Pacific Die Attach Equipment Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

The market is segmented by Technique (Die bonder(Epoxy/Adhesive, Eutectic, Solder, Sintering), Flip chip bonder(Pick and Place/reflow soldering, Thermocompression, Thermosonic Bonding, Hybrid Bonding)), Application (Memory, LED, Logic, CMOS Image Sensor(CIS), Optoelectronics/Photonics, Discrete Power Devices, MEMS & Sensors, Stacked Memory & RF), and Country (Taiwan, China, Japan, Korea, Southeast Asia).

APAC Die Attach Equipment Industry Overview

The APAC Die attach equipment market is moderately competitive, with a large number of players having a small market share. The companies keep innovating and entering into strategic partnerships to maintain their market share.

April 2022 - Driving the Electric Revolution Industrialization Centre (DER-IC) North East has received equipment from Inseto, a top technical distributor of tools and materials, to improve its power electronics, machines, and drives (PEMD) capabilities. The first micro-punch machine to be installed in the UK is an AMX P100 sinter press, which is part of the equipment provided and will allow the production of high-reliability, high-power modules.
June 2022 - The new 7KF Bonder Series has been developed by West Bond. This well-known company designs and manufactures a line of wire bonding and die-to-attach machines, wire pull and shear test equipment, ultrasonic components, and accessories for the microelectronics packaging industry. This excellent tool is made to handle the difficult bonding applications found in the RF, microwave, semiconductor, hybrid, and medical device fields.