APAC Semiconductor Device Industry Overview
The Asia Pacific Semiconductor Device Market is fragmented and is expected to grow in competition during the forecast period. The vendors are focusing on developing customized solution portfolios to fulfill local requirements. Some of the major players operating in the market include Intel Corporation, Nvidia Corporation, Kyocera Corporation, Qualcomm Incorporated, STMicroelectronics NV, Micron Technology Inc., Xilinx Inc., NXP Semiconductors NV, Toshiba Corporation, Texas Instruments Inc., Taiwan Semiconductor Manufacturing Company (TSMC) Limited, SK Hynix Inc., Samsung Electronics Co. Ltd., Fujitsu Semiconductor Ltd., etc.
- August 2022: Toshiba Electronic Devices and Storage Corporation launched the TWxxNxxxC series, a third-generation silicon carbide (SiC) MOSFETs with low on-resistance and significantly reduced switching loss. The products reduce on-resistance per unit area (RDS(ON)A) by approximately 43%, allowing for an 80% reduction in the drain-source on-resistance gate-drain charge (RDS(ON) Qgd). This critical index represents the relationship between conduction loss and switching loss.
- July 2022: Micron Technology, Inc. announced that it had begun volume production of the world's first 232-layer NAND, built with industry-leading innovations to drive unprecedented performance for storage solutions. Micron's 232-layer NAND is a watershed moment for storage innovation as the first proof of the capability to scale 3D NAND to more than 200 layers in production.
APAC Semiconductor Device Market Leaders
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Intel Corporation
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Nvidia Corporation
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Kyocera Corporation
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Qualcomm Incorporated
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STMicroelectronics NV
- *Disclaimer: Major Players sorted in no particular order
