APAC Semiconductor Device Industry Overview
The APAC semiconductor devices market in consumer electronics is fragmented with several players like Intel Corporation, Kyocera Corporation, Toshiba Corporation, etc. The companies continuously invest in strategic partnerships and product developments to gain substantial market share. Some of the recent developments in the market are:
- May 2024: SK Hynix has unveiled ZUFS 4.0, a cutting-edge solution designed specifically for on-device AI applications in mobile devices, notably smartphones. Positioned as a flagship offering, the company anticipates that ZUFS 4.0 will not only solidify its leadership in AI memory within the NAND segment but also further leverage its success in high-speed DRAM, as seen with HBM.
- March 2024: Toshiba has introduced eight new products to its M4K Group within the TXZ+ Family of Advanced Class 32-bit microcontrollers. These microcontrollers are powered by the Cortex-M4 core with FPU. The latest additions come in four different package types and boast an enhanced flash memory capacity of 512KB/1MB, a significant upgrade from Toshiba's previous maximum of 256KB. Additionally, the RAM capacity has been boosted from 24KB to 64KB across the range.
APAC Semiconductor Device Market Leaders
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STMicroelectronics NV
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NXP Semiconductors NV
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Toshiba Corporation
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Taiwan Semiconductor Manufacturing Company (TSMC) Limited
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SK Hynix Inc.
- *Disclaimer: Major Players sorted in no particular order