Automotive Power Module Packaging Industry Overview
The automotive power module packaging market isvery competitive in nature. The market is highly consolidateddue to the presence of largeplayers. The major players in the market are Amkor Technology, Kulicke & Soffa, PTI Technology Inc., Infineon Technologies, STMicroelectronics, Fuji Electric Co. Ltd., Toshiba Electronic Device & Storage Corporation, among others.
- September 2019 -STMicroelectronics planned to supply advanced silicon-carbide power electronics to Renault-Nissan-Mitsubishi for high-speed battery charging in Next-Generation Electric Vehicles.
- May 2019 -New Infineon HybridPACKpower modules enable fast and flexible electrification of vehicles to support the automotive industry in building up a broad and cost-competitive portfolio of hybrid and electric vehicles. Furthermore, Infineon introduces the HybridPACK Double-Sided Cooling (DSC) S2, a technology upgrade to the existing HybridPACK DSC. This module targets main inverters up to 80 kW in hybrid and plug-in hybrid electric vehicles with high power density requirements.
Automotive Power Module Packaging Market Leaders
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Amkor Technologies
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Infineon Technologies
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STMicroelectronics
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Fuji Electric Co. Ltd.
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Toshiba Electronics Device & Storage Corporation
- *Disclaimer: Major Players sorted in no particular order
