Automotive Special Purpose Logic IC Industry Overview
The market for Automotive Special Purpose Logic IC Market is highly competitive. Product innovation, mergers, and acquisitions are some of the techniques used by market players. Furthermore, as the IC manufacturing process improves, allowing for more applications, new industry participants are extending their market presence and expanding their corporate footprint in emerging nations.
- October 2021 - Toyota Motor Corporation chose Renesas Electronics Corporation's R-Car H3 and R-Car M3 system-on-chips (SoCs) for their next-generation multimedia systems. The R-Car H3 and R-Car M3 SoCs are developed for in-vehicle infotainment (IVI) applications that send visuals, audio, and a range of information to the driver in a safe and convenient manner from both in-vehicle and external sources.
- June 2021 - NXP Semiconductors N.V., a world leader in automotive processing, and TSMC announced the volume manufacturing of NXP's S32G2 vehicle network processors and the S32R294 radar processor on TSMC's innovative 16 nanometers (nm) FinFET process technology at COMPUTEX.
Automotive Special Purpose Logic IC Market Leaders
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STMicroelectronics
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Renesas Electronics
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Broadcom Inc.
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Qualcomm Inc.
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NXP Semiconductors
- *Disclaimer: Major Players sorted in no particular order
