How big is the Die Attach Equipment Market?

The Die Attach Equipment Market size is expected to reach USD 1.45 billion in 2024 and grow at a CAGR of 6.09% to reach USD 1.95 billion by 2029. Read More

What is the current Die Attach Equipment Market size?

In 2024, the Die Attach Equipment Market size is expected to reach USD 1.45 billion. Read More

Who are the key players in Die Attach Equipment Market?

Palomar Technologies, Inc., Shinkawa Ltd., MicroAssembly Technologies, Ltd., ASM Pacific Technology Limited and Be Semiconductor Industries N.V. are the major companies operating in the Die Attach Equipment Market. Read More

Which is the fastest growing region in Die Attach Equipment Market?

Asia-Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in Die Attach Equipment Market?

In 2024, the Asia-Pacific accounts for the largest market share in Die Attach Equipment Market. Read More

What years does this Die Attach Equipment Market cover, and what was the market size in 2023?

In 2023, the Die Attach Equipment Market size was estimated at USD 1.36 billion. The report covers the Die Attach Equipment Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the Die Attach Equipment Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

Die Attach Equipment Market - Growth & Industry Analysis

Die Attach Equipment Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

The Die Bonder Equipment Market Trends and is Segmented by Type (Die Bonder, Flip Chip Bonder), Bonding Technique (Epoxy, Eutectic, Soft Solder, Hybrid Bonding), Application (Memory, RF & MEMS, LED, CMOS Image Sensor, Logic, Optoelectronics/Photonics), and Geography (North America Europe, Asia Pacific, Latin America, Middle East and Africa). The Market Size and Forecasts are Provided in Terms of Value (USD ) for all the Above Segments.

Die Attach Equipment Industry Overview

The die-attach equipment market is fragmented as the presence of local and global players penetrates the intense rivalry in the market. Further, players are focusing on improving their equipment performance in terms of throughput and yield through development and partnership, making the market more competitive. Key players are Be Semiconductor Industries N.V., ASM Pacific Technology Limited, Palomar Technologies Inc, etc. Recent developments in the market are -

In October 2022, Hermetic Solutions Group (HSG) acquired the Intellectual property of DiaCool, from RHP Technologies. This expands HSG's product lineup and offers customers significantly more options for many years. HSG's DiaCool diamond composite material for heat sinks, die tabs, and heat spreaders provide customers with significant advantages over conventional laminate or MMC materials.
In October 2022, Kulicke and Soffa received multiple new purchase orders for its thermo-compression solution and successfully shipped its first Fluxless Thermo-Compression Bonder (TCB) to a key customer and continues its position in the advanced LED Assembly.