Market Share of Die Attach Equipment Industry
The die-attach equipment market is fragmented as the presence of local and global players penetrates the intense rivalry in the market. Further, players are focusing on improving their equipment performance in terms of throughput and yield through development and partnership, making the market more competitive. Key players are Be Semiconductor Industries N.V., ASM Pacific Technology Limited, Palomar Technologies Inc, etc. Recent developments in the market are -
- In October 2022, Hermetic Solutions Group (HSG) acquired the Intellectual property of DiaCool, from RHP Technologies. This expands HSG's product lineup and offers customers significantly more options for many years. HSG's DiaCool diamond composite material for heat sinks, die tabs, and heat spreaders provide customers with significant advantages over conventional laminate or MMC materials.
- In October 2022, Kulicke and Soffa received multiple new purchase orders for its thermo-compression solution and successfully shipped its first Fluxless Thermo-Compression Bonder (TCB) to a key customer and continues its position in the advanced LED Assembly.
Die Attach Equipment Market Leaders
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Palomar Technologies, Inc.
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Shinkawa Ltd.
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MicroAssembly Technologies, Ltd.
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ASM Pacific Technology Limited
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Be Semiconductor Industries N.V.
*Disclaimer: Major Players sorted in no particular order
