Die Attach Equipment Market Size (2024 - 2029)

Die Attach Equipment Market Analysis

The Die Attach Equipment Market size is estimated at USD 1.45 billion in 2024, and is expected to reach USD 1.95 billion by 2029, growing at a CAGR of 6.09% during the forecast period (2024-2029).

Growth is fueled by the increased use of stacked die technology in the Internet of Things (IoT) devices. In recent trends, the demand for hybrid circuits has remained strong due to emerging and existing applications in medical, military, photonics, wireless electronics, etc.

• C2W hybrid bonding is a promising emerging technology that can enable direct Cu- Cu bonding and replace TCB for 3D stacked memory and high-end logic applications. However, C2W hybrid bonding is still in its early stages level. It is expected to hit the market in 2022/23 for logic devices with 2.5D structures, significantly assisting the equipment market's growth.
• The demand for the AuSn Eutectic Die-Attach technique drives the market. Traditionally, various die-attach products, which include metal-filled conductive epoxies, high lead-containing solders, and gold-silicon solders, were sufficient to mount the chip and have it perform reliably for the life of the device. 
• However, the trend towards increasing heat generation, demand for compact devices, enactment of RoHS and REACH legislation, and the transition to GaAs chips limited the use of conventional materials. The demand for high device reliability has led engineers to evaluate various new materials for their die attachment.
• The suggested solder preforms are eutectic gold-tin and can be implemented for high volume or lab quantity adoption using a Palomar Technologies' die bonder. This equipment can handle the complete die-attach process, including high-accuracy pick-and-place of substrates, eutectic gold-tin preforms, and components; eutectic die-attach; and pulsed-heat reflow using a computer-controlled Pulse Heat Stage (PHS).
• The demand for discrete power devices drives the market. Copper clips are becoming increasingly popular as an alternative to traditional wire and ribbon bonding. Die-attach functionality is a feature of packaging solutions for discrete power components. The adoption of wide-bandgap semiconductor die technologies (SiC and GaN) brings new innovative packaging solutions, including silver sintering die-attach (materials include epoxy molding compounds and interconnection materials). 
• The progressive transition from discrete SiC towards SiC modules in EV/HEV applications, the embedded-die packaged systems, and the integration of GaN devices in multichip systems are just a few examples of such a trend. This factor enhances the demand for the die attaches equipment for the discrete power devices.
• However, primarily dimensional changes during processing and service life and mechanical unbalance of moving parts during processing through equipment challenges the equipment's functionality which could restrain the market.

Die Attach Equipment Industry Segmentation

Die attach or die bonding is a process of attaching a semiconductor die to a package, a substrate such as a PCB board, or another die. The die attach equipment offering includes multi-chip bonders for advanced packaging through market techniques such as epoxy, soft solder bonders, etc., to various applications such as Memory, RF & MEMS, LED, etc.

The die attach equipment market is segmented by type (die bonder, flip chip bonder), bonding technique (epoxy, eutectic, soft solder, hybrid bonding), application (memory, RF & MEMS, LED, CMOS image sensor, logic, optoelectronics/photonics), and geography (North America Europe, Asia Pacific, Latin America, Middle East and Africa).

The market sizes and forecasts are provided in terms of value (USD) for all the above segments.