Global Dielectric Etchers Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

Dielectric Etchers Industry Overview

The Gloabl Dielectric Etchers Market is very competitive in nature. The market is highly concentrated due to the presence of various small and large players. All the major players account for a large share of the market and are focusing on expanding their consumer base across the world. Some of the significant players in the market are Applied Materials Inc., Hitachi High-Technologies Corporation, Lam Research Corporation, Tokyo Electron, Mattson Technology, Inc., Advanced Micro-Fabrication Equipment Inc., and many more. The companies are increasing the market share by forming multiple partnerships and investing in introducing new products to earn a competitive edge during the forecast period.

• July 2022 - Tokyo Electron and IBM collaborated for the latest front 3D chip stacking that removes the need for a glass wafer base, streamlining the process. IBM and Tokyo Electron, however, have found a way to enable silicon carrier wafers for 3D chipmaking without the drawbacks. This process was demonstrated using a new 300mm module, which the companies say is the first 3D stacked silicon chip wafer at the 300mm level. IBM hopes that the considerable investments in 3D chip stacking technology can help streamline the production process of semiconductors and offer a silver lining to the global chip shortage.
• June 2022 - Lam Research collaborated with SK Hynix to enhance DRAM production cost efficiency with dry resist Extreme Ultraviolet technology. Lam's innovative dry resist fabrication technology is a development tool for two key process steps for producing advanced DRAM chips. This technology introduced by LAM in 2020, dry resist, extends the yield, resolution, productivity, and of EUV (Extreme Ultraviolet) lithography, a pivotal technology in producing next-generation semiconductors. At the material level, Lam's dry resist technology addresses EUV lithography's biggest challenges, enabling cost-effective scaling for advanced memory and logic.