Dynamic Random Access Memory (DRAM) News

Related Semiconductors Industry News

• December 2023: Toshiba Corporation announced the expansion of its new product lineup in CMOS Logic ICs. It has extended the CMOS Logic and One-gate Logic lineup with an extended operating temperature range up to Ta = 125°C. In addition, Toshiba plans to increase general-purpose CMOS logic products and high-temperature guaranteed One-gate Logic(L-MOS), bus switch, and Level shifter products.
• December 2023: Siemens AG, a prominent technology firm, and Intel Corporation, a global giant in the semiconductor industry, inked a Memorandum of Understanding. This collaboration aims to propel the digitalization and sustainability of microelectronics manufacturing. The partnership is expected to prioritize enhancing future manufacturing initiatives, refining factory operations and cybersecurity measures, and bolstering a resilient global industry ecosystem.

• June 2024: STMicroelectronics unveiled its plan to construct an advanced manufacturing facility in Catania, Italy, dedicated to producing power devices and modules using 200mm silicon carbide (SiC) technology. The facility is also claimed to include testing and packaging facilities. According to the company, the establishment is a significant achievement aimed at assisting customers in utilizing SiC devices in many sectors, such as industrial, communications, consumer, and cloud infrastructure.
• October 2023: Samsung Electronics Co. Ltd, a prominent advanced semiconductor technology company, unveiled its latest analog and logic semiconductor technology innovations and outlined its blueprint for technological advancements at the Samsung System LSI Tech Day event. With comprehensive logic solutions tailored for various industries, Samsung emphasized its vision to lead hyper-connected, hyper-intelligent, and hyper-data technologies in the Fourth Industrial Revolution era.

• April 2024: STMicroelectronics announced a new process technology to design and build transistors for next-generation embedded processing devices. The advanced technology was based on an 18nm fully depleted silicon on insulator (FD-SOI) process with embedded phase change memory. This is claimed to have reduced the feature size to 18nm from 20nm. PCMtechnology uses changes in the material phase to store data. It also supports 3V operation for analog features and delivers the reliability required for demanding industrial applications like high-temperature operation, radiation hardening, and data retention capabilities.
• January 2024: Damon Motors Inc. announced a collaboration with NXP Semiconductors, a prominent company in automotive processing and a renowned provider of vehicle electrical/electronic (E/E) architecture and electrification solutions. Through this collaboration, NXP's advanced technology has been integrated into Damon's electronic control units (ECU) and other electronic systems.

• December 2023: Infineon Technologies AG launched the 4.5 kV XHP 3 IGBT modules in response to the global push for downsizing and integration. The 4.5 kV XHP will fundamentally change the landscape for medium voltage drives (MVD) and transportation applications operating at 2000 to 3300 V AC in 2- and 3-level topologies.
• December 2023: STMicroelectronics announced that it had signed a long-term silicon carbide (SiC) supply agreement with Li Auto. Under this agreement, STMicroelectronics would provide Li Auto with SiC MOSFET devices to support Li Auto’s strategy around high-voltage battery electric vehicles (BEVs) in various market segments.

• August 2024 - OKI Circuit Technology has launched an ultra-high-multilayer PCB line at its Joetsu Plant, Niigata Prefecture, started operations in July. The new line, enhancing production capacity by 1.4 times, supports semiconductor manufacturing and testing for AI, data centers, and next-gen communication networks. It features high-precision circuit formation with a via pitch of 0.23 mm and improved line width accuracy. The AOI automated inspection equipment has been relocated to optimize production flow and quality.
• April 2023 - Hitachi High-Tech Corporation announced that it would construct a new production facility in the Kasado Area of Kudamatsu City, Yamaguchi Prefecture, with an aim to increase the production capacity of etching systems for its semiconductor manufacturing equipment business, with production scheduled to begin in FY2025.

• April 2024: Infineon Technologies AG, a prominent player in power systems and IoT, announced that it is strengthening its outsourced backend manufacturing footprint in Europe and revealed a multi-year partnership with Amkor Technology Inc., a significant semiconductor packaging and test service provider. The companies have agreed to operate a dedicated packaging and test center at Amkor's manufacturing site in Porto. The operations are anticipated to begin in the first half of 2025. With this long-term agreement, Infineon and Amkor are likely to strengthen their partnership further, extending the classical Outsourced Semiconductor Assembly and Test (OSAT) business model.
• February 2024: Infineon Technologies AG announced that Infineon and Honda Motor Co. Ltd signed a memorandum of understanding to build a strategic collaboration. Honda selected Infineon as a semiconductor partner to align future technology and product roadmaps. Infineon will support Honda with technologies that facilitate competitive and advanced vehicles. The technical support would focus on the area of power semiconductors, advanced driver assistance systems, and E/E architectures, where both parties would collaborate on new architecture concepts.

• March 2024: MPI Corporation, a global player in semiconductor testing solutions, announced a partnership with Keysight Technologies, a global innovation partner delivering design, test, and emulation solutions to aid engineers in developing and deploying faster. This collaboration is claimed to mark a significant milestone for MPI's Advanced Semiconductor Test (AST) division, with the company being a prominent contender in the semiconductor test industry.
• February 2024: FormFactor Inc. announced closing its sale of Suzhou and Shanghai companies to Grand Junction Semiconductor Pte Ltd (GJS) for USD 25 million. The transaction is part of a long-term partnership between the two companies, initially announced on February 7, 2024, which also includes an exclusive distribution and partnership agreement to continue sales and support of FormFactor’s products in China.

• April 2024: Ark Electronics, a leading electronic manufacturing company, unveiled plans to expand its global factory network. The company will introduce electronics manufacturing service (EMS) capabilities in Mexico and Europe. This move aligns with Ark's strategy of establishing a low-cost country network, enhancing customer flexibility, and offering various manufacturing solutions. With these new capabilities, Ark Electronics enables OEMs to conduct PCB Assembly in Asia and integrate it with services in Mexico or Europe, such as configured-to-order (CTO), testing, and packaging. This integration ensures high quality and minimizes overall tariff costs for OEMs.
• February 2024: The Semiconductor Joint Undertaking (Chips JU) unveiled EUR 216 million (~USD 231.35 million) in calls for proposals. These funds aim to strengthen research and innovation in semiconductors, microelectronics, and photonics. The initiative aims to fortify collaboration within the European semiconductor industry, enhance industrial competitiveness, and facilitate the seamless knowledge transition from research labs to production facilities.

• January 2024 - Texas Instruments unveiled advanced semiconductors to enhance automotive safety and intelligence. The AWR2544 77GHz millimetre-wave radar sensor chip is tailored for satellite radar architectures. This innovation boosts sensor fusion and decision-making in Advanced Driver-Assistance Systems (ADAS), paving the way for elevated autonomy. Additionally, TI rolled out software-programmable driver chips: the DRV3946-Q1, an integrated contactor driver, and the DRV3901-Q1, an integrated squib driver for pyro fuses. Both chips have built-in diagnostics and uphold functional safety for battery management and powertrain systems. TI showcased these products at the 2024 Consumer Electronics Show (CES).
• January 2024 - AMD, a leading semiconductor manufacturer, has unveiled two cutting-edge products tailored for the automotive sector. The Versal AI Edge XA adaptive SoC and the Ryzen Embedded V2000A are engineered to enhance automakers' capabilities in infotainment, bolster advanced driver safety, and support autonomous driving services.

• April 2024: Vishay Intertechnology Inc. introduced the IHDF-1300AE-1A, a new Automotive Grade edge-wound, through-hole inductor tailored for high current and high-temperature applications in the automotive sector. This device incorporates ferrite core technology and boasts a compact maximum profile of 15.4 mm. It operates effectively within a challenging temperature range of -55 °C to +155 °C, ensuring minimal AC and DC power losses while providing superior heat dissipation.
• February 2024: TDK Corporation unveiled its latest MHQ1005075HA series of inductors designed explicitly for high-frequency automotive circuits. This new product maintains the same materials and manufacturing techniques as its conventional counterparts while incorporating TDK's unique design expertise to enhance the internal structure, focusing on fail-safe design principles. The series is available in a compact 1005 size (1.0 × 0.5 × 0.7 mm - L x W x H), with inductance values ranging from 1.0 nH to 56 nH.