Market Share of Electronic Packaging Industry
The electronic packaging market is fragmented. Microsystems are used in almost every industry vertical, with some significant sections being consumer electronics, healthcare equipment, aerospace and defense, communications, etc. The major market players include UFP Technologies, Schott AG, Sealed Air Corporation, DuPont de Nemours, Inc., and Sonoco Products Company.
- In September 2023, Schott AG unveiled new microelectronic packages for the aerospace industry. The packages aim to extend the life of avionics protection while reducing the weight by up to 75% compared to conventional electronic packaging made from Kovar iron-nickel alloy. The products are also said to protect sensitive electronics, such as radio frequency designs, direct current/direct current converters (DC/DC), electrical storage devices, and sensor components.
Electronic Packaging Market Leaders
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UFP Technologies, Inc.
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Sealed Air Corporation
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DuPont de Nemours, Inc.
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SCHOTT AG
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Sonoco Products Company
*Disclaimer: Major Players sorted in no particular order
