Market Trends of Embedded Die Packaging Industry
This section covers the major market trends shaping the Embedded Die Packaging Market according to our research experts:
Die in Flexible Board Expected to Hold Significant Market Share
- With the increased advancement in technology, the product sale value of the printed circuit board is increasing and with the increased adoption of the flexible board in various wearable and IoT devices, the sales are expected to grow higher in future.
- Stretchable Electronics (SC) is so far commercial and comes in many shapes and forms. The technology uses standard printed circuit board, mainly flexible board, where liquid injection molding techniques involve elastomer embedded stretchable electronic circuit, which achieves a robust and reliable product. For instance, in military usage, uniforms and armors can have embedded, flexible, lightweight impact sensors that could store and provide better information of the injury sustained during combat.
- Flexible hybrid electronics (FHE), which is considered as a novel approach to electronic circuit manufacturing, aims to combine the best of conventional and printed electronics. Additional components and as many as conductive interconnects are possible to be printed onto a flexible substrate, whereas the IC is produced using photolithography and then mounted, as a bare die.
- The embedding activity of flexible circuits are in high trend for their implementation in various miniature electronic devices. For instance, in September 2019, IDEMIA and Zwipe collaborated for a biometric payment card solution, where the solution is planned to be distinguished by its relatively small number of components, with things, like the Secure Element and the microcontroller, all embedded in a single chip mounted on a flexible printed circuit board.
- Further, autonomous systems for sports applications and healthcare mainly benefit from a small form factor, as minute structures result in maximal flexibility and comfort. The embedding of a commercially available IC in a flexible circuit board (FCB) can reduce the overall size of a system. The usage of liquid crystal polymer (LCP) as base material for sensors are highly used in medical products. Miniaturized smart sensor modules for medical applications can be fabricated from LCP substrates using conventional flex circuit thin film and standard assembly processes and equipment.
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North America Expected to Hold Significant Market Share
- Countries in the region, such as United States assist the world in manufacturing, designing, and researching related to the semiconductor industry and United States is also the frontrunner in semiconductor packaging innovation having 80 wafer fabrication plants spread across 19 states where new technologies is being implemented such as miniaturization through embedded die etc. Apart from this, investments in this country by global players are setting to fuel the market.
- For instance, Intel is enabling Next-Generation Platforms using Intel’s 3D System-in-package technology through Embedded Multi-die Interconnect Bridge (EMIB) , an elegant and cost-effective approach to in-package high density interconnect of heterogeneous chips. The industry refers to this application as 2.5D package integration. Instead of using a large silicon interposer typically found in other 2.5D approaches, Embedded Multi-die Interconnect Bridge (EMIB) uses a very small bridge die, with multiple routing layers. This bridge die is embedded as part of our substrate fabrication process.
- Apart from this, the United States is home to some of the major automotive players in the world, which are investing in the electric car segment. The embedded systems increases the driving comfort with driver assistance functions like adaptive cruise control. Also to achieve significant energy savings, a distributed embedded control approach becomes necessary to control the power management of the entire vehicle. This is set to increase the demand for embedded die technology.
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