EUV Lithography Market Size (2024 - 2029)

EUV Lithography Market Analysis

The EUV Lithography Market size is estimated at USD 10.34 billion in 2024, and is expected to reach USD 17.81 billion by 2029, growing at a CAGR of 11.5% during the forecast period (2024-2029).

EUV lithography makes the usage of light with a wavelength of just 13.5 nm, which is a reduction of almost 14 times the wavelength of the other lithography techniques in advanced chipmaking, Deep Ultraviolet lithography, which uses 193 nm light. ASML, which is the dominant player in the market, has been exploring ways to reduce transistor sizes and has made considerable strides in the field of EUV lithography, which enables more precise and efficient production of semiconductors at small transistor scales around 7nm node size or even 5nm.

• As semiconductor geometries tend to grow smaller and smaller, the adoption of EUV lithography technology has become extremely important, as it enables scaling down of intricate patterns on wafers by providing an optimal and efficient choice for next-generation applications, including 5G, AI, and Automotive. EUV technology allows the chip makers to keep driving chip scaling as the shorter wavelength of EUV light is capable of printing the nanometer-scale features of the designs related to the advanced techniques.
• TSMC's Extreme Ultraviolet (EUV) tools are expected to reach production maturity, with tool availability already reaching target goals for high-volume production and output power of greater than 250 watts for daily operations. Chipmakers are banking on EUV at 7nm, 5nm, and beyond for leading-edge logic, and today there are no other options available. The next-generation lithography technologies are not ready and can not be applied at 7nm and 5nm scales. At 3nm and beyond, chipmakers hope to use high-NA EUV, but several challenges have yet to be overcome in developing this technology.
• TSMC has also been planning to start the volume production of the 3-nm products by 2022. Samsung Electronics Co. Ltd, another major player in the market, aims to overtake TSMC by 2030 with its extreme ultraviolet (EUV) lithography technology. TSMC, previously in Dec 2019, announced that the company would be starting to supply 5 Nm process-based chips in the first half of 2020 and will be starting mass production of 3-nm process chips in 2022. The company also anticipates producing 2-nm process products by 2024.
• ASML faced difficulty exporting its equipment due to COVID-19, negatively affecting major global semiconductor producers, including Samsung Electronics and TSMC. A delay in the company's equipment delivery is forcing the two companies to change their strategic development and production roadmaps. Due to a delay in the delivery of the company's equipment, the two companies have to alter their strategic development and production plans. TSMC has postponed the test production of 3-nm semiconductors. Samsung Electronics, meantime, had hoped to commence commercial production of 5-nm semiconductors in 2020 but was unable to do so until late 2021.

EUV Lithography Industry Segmentation

Extreme Ultraviolet (EUV) lithography uses a EUV light of an extremely short wavelength of 13.5 nm. It allows exposure of delicate circuit patterns with a half-pitch below 20 nm that the conventional optical lithography cannot expose. Putting the technology into practical use requires a variety of element technologies, including the light source, optics, masks, photoresist, and lithography tools.

The Extreme Ultraviolet Lithography Market is segmented by Product Type (Light Sources, Mirrors, Masks), Ens-User (Foundry, Integrated Device Manufacturers), and Geography.