How big is the Fan Out Packaging Market?

The Fan Out Packaging Market size is expected to reach USD 2.94 billion in 2024 and grow at a CAGR of 16.5% to reach USD 6.30 billion by 2029. Read More

What is the current Fan Out Packaging Market size?

In 2024, the Fan Out Packaging Market size is expected to reach USD 2.94 billion. Read More

Which is the fastest growing region in Fan Out Packaging Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in Fan Out Packaging Market?

In 2024, the Asia Pacific accounts for the largest market share in Fan Out Packaging Market. Read More

What years does this Fan Out Packaging Market cover, and what was the market size in 2023?

In 2023, the Fan Out Packaging Market size was estimated at USD 2.52 billion. The report covers the Fan Out Packaging Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the Fan Out Packaging Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

Fan Out Packaging Market - Size, Share & Analysis

Fan Out Packaging Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

The Report Covers Fan Out Packaging Materials and Equipment Market Growth and it is segmented by Market Type (Core Fan-Out, High-Density Fan-Out, Ultra High-density Fan Out), Carrier Type (200mm, 300mm, Panel), Business Model (OSAT, Foundry, IDM) and Geography.

Fan Out Packaging Industry Overview

The market is moderately fragmented, with the presence of numerous players. Some of the major players operating in the global fan-out packaging market include Taiwan Semiconductor Manufacturing Company Limited, Jiangsu Changjiang Electronics Tech Co., Amkor Technology Inc., Samsung Electro-Mechanics, and Powertech Technology Inc., among others. These players indulge in product innovation, mergers, and acquisitions, among other developments, in order to increase market share.

November 2021 - Amkor Technology, Inc., a semiconductor packing and test service supplier, stated that it intends to construct an intelligent factory in Bac Ninh, Vietnam. The proposed factory's initial phase will concentrate on offering Advanced System in Package (SiP) assembling and testing services to the world's premier semiconductor and electronics manufacturing businesses.
February 2021 - Samsung Foundry has filed documents with authorities in Arizona, New York, and Texas seeking to build a leading-edge semiconductor manufacturing facility in the USA. The potential fab near Austin, Texas, is expected to cost over USD 17 billion and create 1,800 jobs. It is expected to go online by the fourth quarter of 2023.