SRAM & ROM Design IP Industry Overview
The global SRAM and ROM Design IP market are moderately fragmented. Players in the market are innovating their offering according to the technological trends and latest developments. Moreover, they focus on strategic collaboration to increase their market share. Some of the key developments in the market are :
- In May 2020 - Mentor Graphics Corporation announced that it has achieved certification for a broad array of Mentor integrated circuit (IC) design tools for TSMC's industry-leading N5 and N6 process technologies. In addition, Mentor's collaboration with TSMC has extended to advanced packaging technology, further leveraging Mentor's Calibre platform 3DSTACK packaging technology to support TSMC's advanced packaging platforms.
- In March 2020 - Everspin Technologies Inc. amended its spin-transfer torque (STT-MRAM) joint development agreement (JDA) with GLOBALFOUNDRIES (GF), a specialty foundry. Everspin and GF were partners on 40-nm, 28-nm, and 22-nm STT-MRAM development and manufacturing processes. They updated their agreement to set the terms for a future project, on an advanced 12-nm FinFET MRAM solution.
SRAM & ROM Design IP Market Leaders
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Xilinx Inc.
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Dolphin Technology Inc.
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eMemory Technology, Inc.
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Avalanche Technology Inc.
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TDK Corporation
- *Disclaimer: Major Players sorted in no particular order
