How big is the Global Substrate Market?

The Global Substrate Market size is expected to reach USD 4.13 billion in 2024 and grow at a CAGR of 4.88% to reach USD 5.24 billion by 2029. Read More

What is the current Global Substrate Market size?

In 2024, the Global Substrate Market size is expected to reach USD 4.13 billion. Read More

Who are the key players in Global Substrate Market?

TTM Technologies Inc. , BECKER & MULLER SCHALTUNGSDRUCK GMBH , Advanced Circuits , Sumitomo Electric Industries Ltd and Wurth Elektronik Group (Wurth Group) are the major companies operating in the Global Substrate Market. Read More

Which is the fastest growing region in Global Substrate Market?

Asia-Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in Global Substrate Market?

In 2024, the Asia-Pacific accounts for the largest market share in Global Substrate Market. Read More

What years does this Global Substrate Market cover, and what was the market size in 2023?

In 2023, the Global Substrate Market size was estimated at USD 3.94 billion. The report covers the Global Substrate Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the Global Substrate Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

Substrate Market - Size, Share & Industry Growth

Substrate Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

The Report Covers Global Flexible Substrate Market Analysis and is Segmented by Application (Computing, Consumer, Industrial/Medical, Communication, Automotive, and Military/Aerospace). The substrate Like PCB (SLP) Market is Segmented By Application (Consumer Electronics, Automotive, Communication, and Other Applications). The System In the Package (SIP) Market is Segmented By Application (Telecom and Infrastructure (Servers and Base Stations), Automotive and Transportation, Mobile and Consumer, Medical and Industrial, Aerospace and Defense). The market size and forecasts are provided in terms of value (USD billion) for all the above segments.

Substrate Industry Overview

The global substrate market is highly fragmented. Manufacturers globally have depended on designs, such as high-density interconnect (HDI) PCBs, to place more hardware in limited space. HDI PCBs use high-performance and coreless construction. Compared to traditional PCBs, they sport more densely packed wiring, miniaturized laser vias, capture pads, and other features. The industry's established players are leveraging their manufacturing capabilities and research and development capabilities to drive innovation and sustain their competitive position in the market.

In October 2022, the manufacturer of Powerelements for PCB contacting, Würth Elektronik ICS, launched a new generation of its tried-and-true lead-free high-current contacts: the second PowerPlus generation, LF PowerPlus 2.0, has the same torque and current-carrying capacity as the first generation but is now even easier to process and more effective to assemble. Würth Elektronik ICS provides reliable and effective high-current contacts for PCB contact in press-fit technology applications with the LF PowerPlus product family. They are perfect for fastening elements or attaching cables and components to the PCB, especially when high torques are needed or there is limited installation space.
In September 2022, TTM Technologies Inc.'s Radio Frequency & Specialty Components Business Unit, a microwave and RF-based technology specialist, signed a distribution agreement with RFMW, a pure play premier distributor for radio frequency ("RF") and microwave components and semiconductors. TTM will make available through RFMW the entirety of its line of RF&S goods, including its well-known Xinger brand product lineup. Opportunities will be identified and developed, technical sales support will be provided, and distribution will be included in the distribution services. The RFMW online store will also provide the TTM components.