Market Share of High Density Packaging Industry
The High density packaging market is fragmented due to the presence of major players in the marketlikeToshiba Corporation,Fujitsu Ltd.,Hitachi, Ltd.,IBM Corporation, SPIL, Micro Technology and others, are the key players in the market without any dominating player.
- Jan2019 -Red Hat stockholders voted to approve the merger with IBM. The transaction is subject to customary closing conditions, including regulatory reviews and is expected to close in the second half of 2019. IBMannounced its intent to acquire all of the outstanding shares of Red Hat, Inc. The combination of Red Hat’s vast portfolio of open-source technologies, innovative cloud development platform and developer community, combined with IBM’s innovative hybrid cloud technology, industry expertise, and commitment to data, trust, and security, will deliver the hybrid cloud capabilities required to address the next chapter of cloud implementations.
- Jul 2018-Amkor Technology, Inc.an advance provider of outsourcedsemiconductor packaging services, declared that with the partnership ofMentor to release Amkor’s SmartPackagePackage AssemblyDesign Kit, the first in the industry to support Mentor’s High-Density Packaging design method and tools;can now be done in association with Mentor’s software to produce fresh, accelerated and detailed confirmation results of advanced packages required forInternet-of-Things, automotive, and artificial intelligence applications.
High Density Packaging Market Leaders
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Toshiba Corporation
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IBM Corporation
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Fujitsu Ltd.
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Hitachi, Ltd.
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Mentor - a Siemens Business
*Disclaimer: Major Players sorted in no particular order
