What is the current High Density Packaging Market size?

The High Density Packaging Market is projected to register a CAGR of 12% during the forecast period (2024-2029) Read More

Who are the key players in High Density Packaging Market?

Toshiba Corporation, IBM Corporation, Fujitsu Ltd., Hitachi, Ltd. and Mentor - a Siemens Business are the major companies operating in the High Density Packaging Market. Read More

Which is the fastest growing region in High Density Packaging Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in High Density Packaging Market?

In 2024, the North America accounts for the largest market share in High Density Packaging Market. Read More

What years does this High Density Packaging Market cover?

The report covers the High Density Packaging Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the High Density Packaging Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

High Density Packaging Market Size & Share Analysis - Industry Research Report

High Density Packaging Industry Overview

The High density packaging market is fragmented due to the presence of major players in the marketlikeToshiba Corporation,Fujitsu Ltd.,Hitachi, Ltd.,IBM Corporation, SPIL, Micro Technology and others, are the key players in the market without any dominating player.

Jan2019 -Red Hat stockholders voted to approve the merger with IBM. The transaction is subject to customary closing conditions, including regulatory reviews and is expected to close in the second half of 2019. IBMannounced its intent to acquire all of the outstanding shares of Red Hat, Inc. The combination of Red Hat’s vast portfolio of open-source technologies, innovative cloud development platform and developer community, combined with IBM’s innovative hybrid cloud technology, industry expertise, and commitment to data, trust, and security, will deliver the hybrid cloud capabilities required to address the next chapter of cloud implementations.
Jul 2018-Amkor Technology, Inc.an advance provider of outsourcedsemiconductor packaging services, declared that with the partnership ofMentor to release Amkor’s SmartPackagePackage AssemblyDesign Kit, the first in the industry to support Mentor’s High-Density Packaging design method and tools;can now be done in association with Mentor’s software to produce fresh, accelerated and detailed confirmation results of advanced packages required forInternet-of-Things, automotive, and artificial intelligence applications.