Market Share of Memory Packaging Industry
The memory packaging market is moderately competitive. With the rising prices of DRAM memory, vendors operating in the memory packaging market are increasingly spending on the development of 3D NAND. According to an article published by SK Hynix Inc., companies can no longer keep up with 3D NAND demand and are required to expand their manufacturing capacity. Also, many of the companies are expanding their manufacturing units in order to meet the growing demand. Overall the market might move towards highly competitive during the forecast period due to all the above factors.
Memory Packaging Market Leaders
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Lingsen Precision Industries Ltd.
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Hana Micron Inc.
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ASE Kaohsiung
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Amkor Technology Inc.
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Powertech Technology Inc...
*Disclaimer: Major Players sorted in no particular order
