Market Trends of Memory Packaging Industry
DRAM is Estimated to Hold Significant Share
- The market studied is witnessing demand from mobile and the computing (mainly servers). On average, the DRAM memory capacity per smartphone is anticipated to rise more than threefold to reach around 6GB by 2022.
- Recently, Samsung Electronics Co. Ltd, one of the dominant players in the market studied, announced the mass production of the new memory package aimed at high-end smartphones, which may save space by putting DRAM and eMMC together.
- For mobile applications, memory packaging is expected to remain on the wire-bond platform mostly. However, it will soon begin moving toward the multi-chip package (ePoP) for high-end smartphones. With the improvement in enterprise architecture and cloud computing, the computing DRAM packaging is anticipated to witness significant growth during the forecast period.
- Samsung’s HBM2 technology consists of eight 8Gbit DRAM dies, which are stacked and connected using 5,000 TSVs. Recently, the company also launched a new HBM version that stacks 12 DRAM dies, which are connected using 60,000 TSVs and are ideal for data-intensive applications, such as AI and HPC.
- DRAM memory capacity per smartphone has risen with new devices offering a minimum of 4 Gb space which is expected to reach a minimum of 6 GB to 8 GB of space by 2020, while NAND capacity per smartphone has increased reaching more than 64 GB now and are expected to become reach over 150 GB by 2020. For servers, DRAM capacity per unit is projected to increase to approximately 1 TB by 2020 and NAND capacity for each SSD for the enterprise market are expected to reach more than 5 TB in capacity by the end of the forecast period
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Automotive Industry to Hold Significant Share
- The automotive market, which uses the low density (low-MB) memory, might observe an increase in the acceptance of DRAM memory, led by the growing trend of autonomous driving and in-vehicle infotainment. NOR Flash memory packaging market is also expected to grow due to its application in new areas, such as touch display driver ICs, AMOLED display, and industrial IoTs.
- As part of the growth strategy, numerous OSAT players are entering into strategic alliances with memory chip manufacturers, and regional players are partnering with global technology providers to increase their reach in the market.
- Manufacturers operating in the market are expanding their production facilities. For instance, SK Hynix Inc. is expanding its semiconductor packaging and inspection facility capacity in South Korea. Such developments are expected to help create increased opportunity for the existing players and cut competitors edge in the market studied.
- The innovations being introduced in the packaging technology are associated with the growth in functional density of large system-on-chip (SoC) solutions. However, harsh reliability requirements in the automotive environment and changing landscape of the OSATs industry is anticipated to hamper the growth of the market studied over the forecast period.
- In recent times, there has been growth in the use of Si-based sensor technology for a variety of applications, including biometric sensors, CMOS image sensors, and MEMS sensors, such as accelerometers. Increasingly, and sensor devices are being integrated into portable devices, like handsets and PDAs. In these applications, small-size, low-cost, and ease-of-integration are essential to incorporate this sensor technology successfully.
- Generally, OEMs prefer a plug-and-play module or complete subsystem, which is also a factor that is helping the memory chip market, and in turn, driving the demand for the memory packaging for enhanced technological applications.
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