MEMS Packaging Industry Overview
The MEMS packaging market is moderately competitive. As the industry is capital intensive, major vendors in the market are banking on diverse product portfolios and product development to gain an edge. The innovation capabilities of the vendors are highly dependent on their R&D investments. Additionally, the industry's capital-intensive nature poses an entry barrier to new entrants. Some key players operating in the market are ChipMos Technologies Inc., AAC Technologies, Bosch Sensortec GmbH, Infineon Technologies AG, and Analog Devices, Inc., among others.
- August 2022 - MEMSIC, a leading MEMS technology solution provider, releases the first MEMS 6-axis inertial sensor (IMU) MIC6100HG. The product integrates a 3-axis accelerometer and a 3-axis gyroscope, which can support motion-sensing interactive systems such as smart remote controls and game controllers with sensitive sensing. Additionally, the MIC6100HG 6-axis IMU sensor has a large FIFO and supports I2C/I3C/SPI communication mode. The LGA package size is 2.5x3x0.83mm, and the data output frequency is 2200Hz.
- February 2022 - STMicroelectronics introduced its third generation of MEMS sensors. According to the company, the new sensors are designed to enable the next leap in performance and features for smart industries, consumer mobiles, healthcare, and retail sectors. The newly launched LPS22DF and waterproof LPS28DFW barometric pressure sensors, which operate from 1.7ĀµA and have absolute pressure accuracy of 0.5hPa and are packed in one of the smallest footprints (2.0 x 2.0 x 0.74mm).
MEMS Packaging Market Leaders
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ChipMosĀ Technologies Inc.
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AAC Technologies Holdings Inc.
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Bosch Sensortec GmbH
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Infineon Technologies AG
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Analog Devices, Inc.
- *Disclaimer: Major Players sorted in no particular order
