Organic Substrate Packaging Material Industry Overview
The organic substrate packaging material market is highly competitive and is dominated by major players, including Amkor Technology Inc, Compass Technology Co. Ltd., Kyocera Corporation, among others, who hold a significant market share while actively expanding their customer base globally. These companies employ strategic collaborative initiatives to enhance their market share and profitability. Nevertheless, due to technological advancements and product innovations, smaller and mid-sized companies are making inroads into new markets by securing unique contracts.
In June 2023, US chipmaker Micron Technology is set to launch its semiconductor assembly and test facility in Gujarat, with plans to commence production as early as 2024. This development will significantly bolster India's chip-making aspirations. The primary focus of the plant will be packaging chips, where it will convert wafers into ball grid array integrated circuit packages, memory modules, and solid-state drives.
In January 2022, Simmtech, a South Korean manufacturer of PCBs and semiconductor packaging substrates, announced the near completion of its first large-scale PCB manufacturing facility located on an 18-acre site in Penang, Malaysia. This facility complements Simmtech's existing PCB operations in Southeast Asia, particularly in South Korea, Japan, and China. It specializes in producing packaging substrates for dynamic random-access memory (DRAM) / NAND memory chips, as well as high-density interconnect (HDI) PCBs for memory modules and solid-state drive (SSD) devices.
Organic Substrate Packaging Material Market Leaders
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Amkor Technology Inc
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Kyocera Corporation
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Microchip Technology Inc.
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Texas Instruments Incorporated
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ASE Kaohsiung
- *Disclaimer: Major Players sorted in no particular order
