Organic Substrate Packaging Material Market Market Size (2024 - 2029)

Organic Substrate Packaging Material Market Analysis

The Organic Substrate Packaging Material Market size is estimated at USD 14.64 billion in 2024, and is expected to reach USD 19.19 billion by 2029, growing at a CAGR of 5.56% during the forecast period (2024-2029).

The organic substrate packaging material market is valued at USD 13.87 billion in the current year. It is expected to register a CAGR of 5.56% during the forecast period to become USD 18.18 billion by the next five years.

• The increasing demand for advanced driver assistance systems (ADAS) would drive the demand for organic substrate packaging material in the forecasted period. According to Intel, international car sales are predicted to reach around 101.4 million units in 2030, and autonomous motorcars are expected to account for about 12% of car registrations by 2030.
• An organic substrate allows the printed circuit board manufacturer to employ an additive screen process instead of an edge-removal, etched method, and the end result is a PCB design that is nearly entirely organic.
• The Internet of Technology (IoT) technologies are being used across various industries. Because of their rapid growth, printed circuit board (PCB) manufacturers have introduced various changes and innovations to meet their clients' demands. From smartphones and fitness trackers to innovative factory equipment, managing space on mobile devices is highly important. With businesses trying to establish their digital footprint and people relying on IoT to drive their routine life functions, this demand is expected to grow in the studied market.
• Moreover, electronics for automotive applications require effective packaging solutions that can withstand high temperatures. For these extreme conditions, a new attempt is necessary based on detailed knowledge about the thermo-mechanical behavior of the utilized organic substrate materials. In addition, with the increasing reliance on electronic components in modern automobiles, incorporating substrate PCBs into specific novel applications is becoming more common. 
• Further, electric and hybrid modes of transport are gaining traction in the Gulf region, especially in Israel, Oman, Saudi Arabia, Jordan, and the United Arab Emirates. For example, through the Dubai Taxi Corporation's Strategic Plan 2021-2023, the Roads and Transport Authority (RTA) of Dubai has declared the signing of a contract to procure 2,219 new vehicles to supplement the fleet of the Dubai Taxi Corporation. The latest batch includes 1,775 hybrid vehicles, bringing the fleet's total number to 4,105. Such expansion in electric vehicles may further drive the studied market demand.
• Various government has significantly invested in boosting the penetration of advanced technologies, bolstering the demand for organic substrate packaging semiconductor packaging. According to WSTS, in October 2022, semiconductor sales in the Americas amounted to USD 12.29 billion, an increase from the USD 12.03 billion recorded for the previous month.
• Furthermore, the players in the market are developing new products to cater to customers' wide range of needs. For instance, in June 2022, PCB Technologies introduced iNPACK, an advanced heterogeneous integration provider of system-in-package (SiP) solutions. iNPACK focuses on high-end technology that improves signal integrity and reduces unwanted inductance effects. This is accomplished through powerful components that increase functionality and utilize embedded coins for heat dissipation. iNPACK provides SiP, semiconductor packaging, organic substrates (25-micron lines and 25-micron spacing), and 3D, 2.5D, and 2D packaging solutions to many of the most demanding industries, including aerospace, defense, medical, consumer electronics, automotive, energy and communications.

Organic Substrate Packaging Material Industry Segmentation

The organic substrate is made of organic materials such as organic resin and epoxy resin. It has a low dielectric constant and is easy to process. It is suitable for high-frequency signal transmission with low thermal conductivity.

The studied market is segmented by various technology such as small thin outline packages, pin grid array (PGA) packages, flat no-leads packages, quad flat package (QFP), and dual inline package (GIP), among various applications such as consumer electronics, automotive, manufacturing, industrial, and healthcare in multiple geographies such as North America, Latin America, Europe, Asia-Pacific, Middle East and Africa, and the Rest of the World) 

The market sizes and predictions are provided in terms of value USD for all the above segments.