How big is the OSAT Market?

The OSAT Market size is expected to reach USD 43.36 billion in 2024 and grow at a CAGR of 8.62% to reach USD 71.21 billion by 2029. Read More

What is the current OSAT Market size?

In 2024, the OSAT Market size is expected to reach USD 43.36 billion. Read More

What years does this OSAT Market cover, and what was the market size in 2023?

In 2023, the OSAT Market size was estimated at USD 39.62 billion. The report covers the OSAT Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the OSAT Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

OSAT Market - Share, Size & Companies

OSAT Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

The Outsourced Semiconductor Assembly and Test Services (OSAT) Market Report is Segmented by Service (Packaging and Testing), Type of Packaging (Ball Grid Array Packaging, Chip-Scale Packaging, Stacked Die Packaging, Multi-Chip Packaging, and Quad Flat and Dual-Inline Packaging), Application (Communication, Consumer Electronics, Automotive, Computing and Networking, Industrial, and Other Applications), and Geography (United States, China, Taiwan, South Korea, Malaysia, Singapore, Japan, and the Rest of the World). The Market Sizes and Forecasts are Provided in Terms of Value in USD for all the Above Segments.

OSAT Industry Overview

The outsourced semiconductor assembly and test services (OSAT) market is fragmented, with the presence of major players like ASE Technology Holding Co. Ltd, Amkor Technology Inc., Powertech Technology Inc., ChipMOS Technologies Inc., and King Yuan Electronics Co. Ltd. Players in the market are adopting strategies such as innovations, partnerships, and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

• December 2023 - In a recent announcement, Powertech Technology (PTI) Inc. revealed its partnership with Winbond Electronics Corporation by signing a letter of intent. This collaboration aims to jointly advance the business of 2.5D (Chip on Wafer on Substrate)/3D advanced packaging. PTI will guide its customers to leverage WEC's silicon Interposer, DRAM, and Flash to enable heterogeneous integration and cater to the market's demand for high-bandwidth and high-performance computing services.

• October 2023 - ASE Technology Holding Co. Ltd launched its Integrated Design Ecosystem (IDE), a collaborative design toolset. This toolset is designed to enhance advanced package architecture across the VIPack platform systematically. This innovative approach enables a seamless transition from single-die SoC to multi-die disaggregated IP blocks, including chiplets and memory. It can be achieved by integrating them using 2.5D or advanced fanout structures.