How big is the Panel Level Packaging Market?

The Panel Level Packaging Market size is expected to reach USD 0.25 billion in 2024 and grow at a CAGR of 41.07% to reach USD 1.38 billion by 2029. Read More

What is the current Panel Level Packaging Market size?

In 2024, the Panel Level Packaging Market size is expected to reach USD 0.25 billion. Read More

Who are the key players in Panel Level Packaging Market?

Samsung Electronics Co. Ltd, Intel Corporation, Nepes Corporation, ASE Group and Powertech Technology Inc. are the major companies operating in the Panel Level Packaging Market. Read More

Which is the fastest growing region in Panel Level Packaging Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in Panel Level Packaging Market?

In 2024, the Asia Pacific accounts for the largest market share in Panel Level Packaging Market. Read More

What years does this Panel Level Packaging Market cover, and what was the market size in 2023?

In 2023, the Panel Level Packaging Market size was estimated at USD 0.15 billion. The report covers the Panel Level Packaging Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the Panel Level Packaging Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

Panel Level Packaging Market Share

Statistics for the 2023 & 2024 Panel Level Packaging market share, created by Mordor Intelligence™ Industry Reports. Panel Level Packaging share report includes a market forecast to 2029 and historical overview. Get a sample of this industry share analysis as a free report PDF download.

Market Share of Panel Level Packaging Industry

The panel level packaging market is semi-consolidated with the presence of major players like Samsung Electronics Co. Ltd, Intel Corporation, Nepes Corporation, ASE Group, and Powertech Technology Inc. Players in the market are adopting strategies such as partnerships and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

December 2023 - NEPES developed 'METIS,' an intelligent semiconductor for edge computing. Metis applied cx-BGA (Ball Grid Array) of nePACTM, Nepes' cutting-edge 2.5D & 3D package platform. nePACTM is a next-generation cutting-edge package technology that implements multi-layer and fine RDL wiring based on fan-out technology and flip-chip bonding technology. It is suitable for highly integrated, high-performance chips such as artificial intelligence semiconductors.
June 2023 - USI, a subsidiary of ASE Technology Holding Co. Ltd, inaugurated another factory in Poland. This move reflects the growing need for the company's products from European customers. By expanding, USI may make more goods in Poland, meet customer needs, and keep up with market growth.