How big is the Power Module Packaging Market?

The Power Module Packaging Market size is expected to reach USD 2.5 billion in 2024 and grow at a CAGR of 9.78% to reach USD 3.98 billion by 2029. Read More

What is the current Power Module Packaging Market size?

In 2024, the Power Module Packaging Market size is expected to reach USD 2.5 billion. Read More

Who are the key players in Power Module Packaging Market?

Fuji Electric Co. Ltd, Infineon Technologies AG, Mitsubishi Electric Corporation (Powerex Inc.), Semikron and Amkor Technology Inc. are the major companies operating in the Power Module Packaging Market. Read More

Which is the fastest growing region in Power Module Packaging Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in Power Module Packaging Market?

In 2024, the Asia Pacific accounts for the largest market share in Power Module Packaging Market. Read More

What years does this Power Module Packaging Market cover, and what was the market size in 2023?

In 2023, the Power Module Packaging Market size was estimated at USD 2.26 billion. The report covers the Power Module Packaging Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the Power Module Packaging Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

Power Module PackagingCompanies

This report lists the top Power Module Packaging companies based on the 2023 & 2024 market share reports. Mordor Intelligence expert advisors conducted extensive research and identified these brands to be the leaders in the Power Module Packaging industry.