Power Semiconductor News

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• March 2024 - POET Technologies announced its entry into the optical module market with an 800G pluggable transceiver called Wavelight for artificial intelligence and cloud data center markets. The Wavelight transceiver incorporates POET's Optical Interposer technology and related optical engine products, designed for use in 800 gigabit ethernet links for up to 2km of reach over single mode fiber.
• March 2024 - Infinera announced ICE-D, a new line of high-speed intra-data center optics based on monolithic indium phosphide photonic integrated circuits. The ICE-D technology combines multiple optical functions onto a single photonic integrated circuit, designed to provide intra-data center connectivity at speeds of 1.6 terabits per second and greater."

• July 2024 - SiCrystal GmbH, a subsidiary of the ROHM Group based in Erlangen, Germany, announced its plans to expand its production capacity for monocrystalline silicon carbide (SiC) wafers. The company is constructing a new 6000 m2 facility directly across from its current location in northeast Nuremberg. Collaborating with the general contractor Systeambau from Hilpoltstein, the construction is slated for completion by early 2026.
• February 2024 - SK Siltron CSS obtained a conditional commitment for a loan of up to USD 544 million from the US Department of Energy (DOE). This loan, part of the Advanced Technology Vehicles Manufacturing (ATVM) Loan Program and overseen by the DOE’s Loan Programs Office (LPO), aims to bolster American production of high-quality SiC wafers. These wafers are essential for the power electronics in electric vehicles (EVs). The funding is expected to enhance the manufacturing capacity at SK Siltron CSS’ facility located in Bay City, Michigan.

• June 2024 - Infineon Technologies AG unveiled the CoolGaN Transistor 700 V G4 product family. These devices excel in power conversion, specifically in the 700 V voltage range. These transistors boast a 20% performance boost in input and output figures-of-merit. This enhancement translates to heightened efficiency, minimized power losses, and more economical solutions. The applications span from consumer chargers and notebook adapters to data center power supplies, renewable energy inverters, and battery storage solutions.
• June 2024 - Elliott, a USD 65 billion hedge fund renowned for its shareholder activism, injected USD 2.5 billion into Texas Instruments. The fund advocates a more flexible approach to capital expenditures to boost the company's free cash flow. In a detailed 13-page letter obtained by CNBC, Elliott suggested Texas Instruments implement a "dynamic capacity-management strategy." As per Elliott, this strategy could potentially elevate the company's free cash flow to USD 9 per share by 2026.

• April 2024: Infineon Technologies AG solidified its dominance in the automotive semiconductor market. TechInsights reported that Infineon bolstered its market share across all regions and maintained its top position in South Korea and China. Notably, Infineon achieved substantial progress in the Japanese automotive semiconductor sector. Infineon reinforced its standing as the second-largest player in Europe and secured a spot in the top three in North America.
• April 2024: Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it started operations at its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan. Renesas aims to boost its production capacity of power semiconductors in anticipation of the growing demand for electric vehicles (EVs).

• In February 2024, the Government of India approved Tata Electronics' proposal to establish a significant semiconductor fabrication facility ("Fab") in Dholera, Gujarat, in collaboration with PSMC. This Fab is slated to produce a maximum of 50,000 wafers monthly, boasting cutting-edge factory automation. Leveraging data analytics and machine learning, the facility aims to set new benchmarks in factory efficiency.
• In June 2024, Vanguard International Semiconductor Corporation (VIS), a Taiwanese IC foundry service provider, and NXP Semiconductors N.V., a prominent Dutch semiconductor manufacturer, unveiled their collaboration to construct a cutting-edge semiconductor wafer manufacturing facility in Singapore. This venture, valued at USD 7.8 billion, will focus on producing 130nm to 40nm mixed-signal, power management, and analog products. The facility's offerings are tailored for a diverse range of sectors, including automotive, industrial, consumer electronics, and mobile devices.

• December 2023 - Sahasra Electronics, a Noida-based company, revealed its intention to allocate approximately INR 350 crore (USD 42.2 million) over the next three years. The investment will be directed toward establishing a semiconductor packaging facility and expanding manufacturing operations as part of the 'Make in India' initiative. The company plans to acquire electronic assembly machines, resulting in an investment exceeding INR 150 crore (USD 18.1 million) for the plant, while an additional INR 50 crore (USD 6 million) will be dedicated to the interior of the building. Such investments in boosting the semiconductor packaging and assembly services are expected to increase the market’s potential.
• November 2023 - JCET Automotive Electronics (Shanghai) Co. Ltd is scheduled to receive a capital injection of RMB 4.4 billion (USD 0.61 billion), resulting in a total registered capital of RMB 4.8 billion (USD 0.67 billion). This investment will hasten the establishment of an advanced packaging facility for automotive chip products in the Lingang Special Area of Shanghai.

• December 2022 - EPC and Vanguard International Semiconductor Corporation (VIS) announced a multi-year production agreement for gallium nitride-based power semiconductors in December 2022. EPC will take advantage of VIS' 8-inch (200 mm) wafer fabrication capabilities, which is expected to significantly increase manufacturing capacity for EPC's high-performance GaN transistors and integrated circuits. Production will begin in early 2023.
• November 2022 - Hua Hong Semiconductor Ltd received regulatory approval for a USD 2.5 billion IPO in Shanghai. The planned initial public offering (IPO) comes as China's chip companies gear up for steeper competition with the United States due to geopolitical tensions. Due to this, Hua Hong intends to use the money to invest in a new fabrication plant - or fab - in the eastern city of Wuxi, with construction set to begin in 2023 and an eventual production capacity of 83,000 wafers per month.

• May 2022: A 200 mm (8) epiwafer for vertical-cavity surface-emitting laser (VCSEL) diodes was created by IQE in Wales. The cost of the laser for 3D sensors is expected to be drastically reduced by switching to a 200 mm compound semiconductor epi wafer. New foundry relationships may result from this, particularly those with high-volume silicon-based foundries that use 200 mm machinery. This may make it possible for compound semiconductors to be integrated into silicon, opening up a wider choice of devices and applications.
• May 2022 - JX Nippon Mining & Metals Corporation company concluded a financing agreement with the Japan Bank for International Cooperation to procure the funding needed to strengthen its business in the manufacturing of sputtering targets for semiconductors in the United States of America.

• June 2022: RIBER, a global market player for molecular beam epitaxy (MBE) equipment serving the semiconductor industry, announced an order for a multi-4' GSMBE 49 production system. The new generation of datacom devices requires highly precise control of the epitaxial growth process, which is achieved by the recognized performance of Riber's machines and by the sophistication of the machine's control software. The ordered machine is expected to be delivered in 2023.
• June 2022: Veeco announced that the Taiwan semiconductor research institute, National Applied Research Laboratories, selected Veeco's propel R&D Metal Organic Chemical Vapor Deposition System. The single wafer platform is ideal for high-volume manufacturing, 300 mm capabilities, and research and development applications.

• March 2022 - KioxiaCorporation, a provider of memory solutions, announced it would start construction of an advanced new fabrication facility at its KitakamiPlant in Japan for the possible expansion of manufacturing of its proprietary 3D Flash memory BiCSFLASHTM. Construction of this facility is planned to commence in April 2022 and is expected to be completed in 2023.
• December 2021 - Micron Technology announced plans for its new memory design center in Midtown Atlanta, the United States, expanding the company's reach into the Southeast United States. Micron aims to establish strong partnerships with many institutions in the region including Georgia Tech, Emory University, Spelman College Morehouse College, and the University of Georgia.