Semiconductor Back-End Equipment Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

Semiconductor Back-End Equipment Industry Overview

The semiconductor back-end equipment market is semi-consolidated due to the presence of both global players and small and medium-sized enterprises. Some of the major players in the market are ASML Holding NV, Applied Materials Inc., LAM Research Corporation, Tokyo Electron Limited, and KLA Corporation. Players in the market are adopting strategies such as partnerships, expansions, and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

• December 2023: Applied Materials and CEA-Leti have expanded their collaboration with a joint lab focusing on materials engineering solutions for specialty semiconductor applications, catering to ICAPS markets (IoT, communications, automotive, power, and sensors). The lab aims to accelerate innovation for next-gen devices by addressing demands from IoT, electric vehicles, and smart grid infrastructure. Projects will tackle materials engineering challenges to enhance ICAPS device performance, reduce power consumption, and achieve faster time to market.
• November 2023: Samsung Electronics and ASML Holding have inked a preliminary agreement to invest 1 trillion WON (USD 760 million) in a joint research and development facility in South Korea. The collaboration, outlined in a memorandum of understanding signed at ASML's headquarters, focuses on advancing memory chips using ASML's cutting-edge extreme ultraviolet (EUV) equipment. As the exclusive EUV scanner manufacturer globally, ASML's technology is pivotal for intricate semiconductor patterning, streamlining manufacturing, and enhancing production yields. The R&D center, the first overseas facility jointly established by ASML, will concentrate on developing ultra-fine semiconductor manufacturing processes based on next-generation EUV technology.