Market Share of Semiconductor Packaging Industry
The semiconductor packaging market is semi-consolidated with the presence of significant players like ASE Technology Holding Co. Ltd, Amkor Technology, Jiangsu Changjiang, Electronics Technology Co. Ltd (JCET), Siliconware Precision Industries Co. Ltd, and Powertech Technology Inc. Players in the market are adopting strategies, such as partnerships and acquisitions, to enhance their product offerings and gain sustainable competitive advantage.
- In April 2024, Samsung's AVP team received an order for advanced packaging for NVIDIA's AI chip, allowing for the future supply of high-bandwidth memory chips. The AVP team at Samsung Electronics will be responsible for providing interposer and 2.5D packaging technology for packaging NVIDIA's AI processors. However, the HBM and GPU chips used in these processors will come from other suppliers. The 2.5D packaging technology allows for the horizontal integration of chips such as CPUs, GPUs, and HBMs on an interposer.
- In December 2023, JCET opened the Semiconductor Packaging and Test Museum in Jiangyin, Jiangsu Province. The museum is a dedicated establishment that exhibits the realm of integrated circuit packaging and testing. It signifies a fresh endeavor by JCET to propel the packaging and testing industry. The museum acts as a prominent symbol for fostering science and technology in the IC sector within Jiangyin while also serving as a platform to showcase the accomplishments of the packaging and testing industry.
Semiconductor Packaging Market Leaders
-
ASE Technology Holding Co. Ltd
-
Amkor Technology
-
Jiangsu Changjiang Electronics Technology Co. Ltd (JCET)
-
Siliconware Precision Industries Co. Ltd
-
Powertech Technology Inc.
*Disclaimer: Major Players sorted in no particular order
