Who are the key players in Semiconductor Wafer Polishing and Grinding Equipment Market?

Applied Materials Inc., Ebara Corporation, Disco Corporation, Tokyo Seimitsu Co. Ltd. (Accretech Create Corp.) and Revasum Inc. are the major companies operating in the Semiconductor Wafer Polishing and Grinding Equipment Market. Read More

Which is the fastest growing region in Semiconductor Wafer Polishing and Grinding Equipment Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in Semiconductor Wafer Polishing and Grinding Equipment Market?

In 2024, the North America accounts for the largest market share in Semiconductor Wafer Polishing and Grinding Equipment Market. Read More

Semiconductor Wafer Polishing and Grinding Equipment Market

Semiconductor Wafer Polishing and Grinding Equipment Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

The Report Covers Semiconductor Wafer Polishing and Grinding Equipment Market Analysis and it is Segmented by Geography (North America, Europe, Asia Pacific, Rest of the World). The market sizes and forecasts are provided in terms of value (USD million) for the above segments.

Semiconductor Wafer Polishing and Grinding Equipment Industry Overview

The semiconductor wafer polishing and grinding equipment market is moderately consolidated and consists of certain major players. The market has gained a competitive edge over the past two decades. In terms of market share, few major players dominate the market, currently. Various vendors are continually updating their existing equipment for better efficiency.

June 2022 - Applied Materials announced that it had acquired Picosun Oy, a privately held semiconductor equipment company based in Finland. The acquisition was expected to broaden the Applied ICAPS (IoT, Communications, Automotive, Power and Sensors) product portfolio and customer engagements.
February 2022 - Revasum announced that it had secured a growth capital facility from SQN Venture Partners, LLC. The facility would provide up to USD 8 million in debt financing to accelerate new product development and provide working capital to support rapid growth.