Substrate Like PCB Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

The Report Covers Global Substrate Like PCB Technology & Manufacturers and the market is segmented by application (consumer electronics, automotive, communication) and geography.

Substrate Like PCB Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

Substrate Like PCB Market Size

substrate like pcb market
Study Period 2019 - 2029
Base Year For Estimation 2023
Forecast Data Period 2024 - 2029
CAGR 12.00 %
Fastest Growing Market Asia Pacific
Largest Market Asia Pacific
Market Concentration High

Major Players

Substrate-Like-PCB Market Major Players

*Disclaimer: Major Players sorted in no particular order

Compare market size and growth of Substrate-Like-PCB Market with other markets in Technology, Media and Telecom Industry

Automation

Digital Commerce

Electronics

Information Technology

Media and Entertainment

Security & Surveillance

Substrate Like PCB Market Analysis

The Substrate-Like-PCB Market is expected to grow at a CAGR of 12% during the forecast period (2022 - 2027). Owing to the rising adoption of substrate-like PCB in OEMs, smart consumer electronics, and wearable devices, there is a growth in the substrate-like PCB market. The need for miniaturization and efficient interconnect solutions is also contributing to substrate-like PCB market growth. At present market is heavily dependent on high-end smartphone growth.

  • A PCB substrate is used as a medium between the PCB Board and the rest of the device body without the loss of any power or misfiring of the device. Interconnectors between both units are utilized to efficiently transfer signals to connected components, reducing the total number of connections and, consequently, the total power consumption.
  • Smartphone OEMs are increasingly using this SLP technology with a shift toward 5G, which is acting as the main driver for the growth of the market. MediaTek, which offers 5G SoCs, announced a doubled shipment in 2020, announcing that they manufactured nearly 40% of global smartphone SoCs. This indicates the growing demand for 5G devices, which is estimated to fuel the growth of substrate-like PCBs during the forecast period.
  • Increasing automobile production and sales and the increased incorporation of advanced safety features, some of which are mandated by government bodies, demand convenience and comfort systems. The growing demand for hybrid electric vehicles (HEV) and battery electric vehicles are the major factors that may drive the market growth during the forecast period.
  • Certain challenges will hinder the overall market growth. Factors such as a shortage of skilled labor and the absence of standards and protocols limit the market growth. Furthermore, complicated integrated systems and high-cost setups associated with substrate-like PCB are expected to slow growth during the forecast period.
  • With the rising trends in technologies such as IoT, 5G, and smart cars, it is required that the size of the PCB would be miniaturized and the substrates become much more powerful. Thus, substrate-like PCB will be used at a massive scale to support these technological trends.
  • Substrate manufacturing has been a massive restraint on the global chip supply chain. The sector's relatively newer origins paired with low margins have forced underinvestment in the market. Moreover, the pandemic forced a severe strain on the existing order of operations, enforced a global chip shortage that constricted personal computer sales, enforced idle plants, and raised costs for electronic devices under lockdown conditions.

Substrate Like PCB Industry Overview

The Substrate-Like-PCB Market is consolidated because the majority of the market share is owned by top players in the industry. Some of the key players include Kinsus Interconnect Technology Corp., Ibiden Co.Ltd., Compeq Manufacturing Co. Ltd., Daeduck Electronics Co. Ltd., Unimicron Technology Corporation, Zhen Ding Technology, Meiko Electronics, TTM Technologies, AT&S, among others.

  • May 2022 - TTM Technologies Inc (TTM), located in the United States, announced a plan to establish a new, highly automated printed circuit board (PCB) manufacturing factory in Penang, Malaysia, with a proposed capital investment of USD 130 million by 2025. The Malaysian expansion addresses rising concerns about advanced technology, PCB supply chain resilience, and regional diversity.

Substrate Like PCB Market Leaders

  1. Kinsus Interconnect Technology Corp.

  2. Ibiden Co. Ltd

  3. Compeq Manufacturing Co. Ltd

  4. Daeduck Electronics Co. Ltd

  5. Unimicron Technology Corporation

  6. *Disclaimer: Major Players sorted in no particular order
Substrate-Like-PCB Market
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Substrate Like PCB Market News

  • January 2022 - Simmtech, a South Korean manufacturer of PCBs and packaging substrates for semiconductors, announced the near completion of its first large-scale PCB factory at an 18-acre site in Batu Kawan Industrial Park in Penang, Malaysia. The factory joins its existing PCB facilities operating in Southeast Asia, especially in South Korea, Japan, and China. The factory manufactures the first packaging substrates for dynamic random-access memory (DRAM) / NAND memory chips and High-Density Interconnect (HDI) PCB for memory module / Solid State Drive (SSD) devices.
  • January 2022 - Austria Technologie & Systemtechnik AG announced the expansion of its manufacturing plant in Ansan, South Korea, which is involved in the production of high-tech printed circuit boards for a wide variety of medical areas. The augmentation increased the floor space to nearly 8,000 sq. m, upgraded involved production equipment, and additionally installed systems, including multilayer flex presses, machines for e-copper coating, and UV lasers, among others. The expansion ensures growth in the medical devices market in the Southeast Asian market, as vendors have easier access to chips.

Substrate Like PCB Market Report - Table of Contents

1. INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis

5. MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increasing Demand for Consumer Electronics and Smart Devices
  • 5.2 Market Restraints
    • 5.2.1 Higher Setup Cost Associated with Substrate-like-PCB

6. MARKET SEGMENTATION

  • 6.1 Application
    • 6.1.1 Consumer Electronics
    • 6.1.2 Automotives
    • 6.1.3 Communication
    • 6.1.4 Other Applications
  • 6.2 Geography
    • 6.2.1 North America
    • 6.2.2 Europe
    • 6.2.3 Asia Pacific
    • 6.2.4 Rest of the World

7. COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Kinsus Interconnect Technology Corp.
    • 7.1.2 Ibiden Co.Ltd.
    • 7.1.3 Compeq Manufacturing Co. Ltd.
    • 7.1.4 Daeduck Electronics Co. Ltd.
    • 7.1.5 Unimicron Technology Corporation
    • 7.1.6 Zhen Ding Technology
    • 7.1.7 TTM Technologies
    • 7.1.8 Meiko Electronics
    • 7.1.9 Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
    • 7.1.10 Korea Circuit
    • 7.1.11 LG Innotek Co.Ltd
    • 7.1.12 Samsung Electro - Mechanics
  • *List Not Exhaustive

8. INVESTMENT ANALYSIS

9. FUTURE OF THE MARKET

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Substrate Like PCB Industry Segmentation

Substrate-like-PCB (SLP) is a term that describes the transition of a PCB board into a product with package substrate-like features. Substrate-like-PCB utilizes thin conductors/interconnectors, which efficiently transfer signal and power to all connected components and reduce power consumption. Moreover, substrate-like-PCB are more effective in circuit protection and heat dissipation. Substrate-like-PCB has reached a line and space that is smaller than 30/30 mm, and substrate-like-PCB is a PCB that has feature sizes close to that of an IC substrate. Substrate-like PCB uses an additive etch process and has many applications.

The Substrate-Like-PCB Market is segmented by Application (Consumer Electronics, Automotive, Communication) and Geography.

Application Consumer Electronics
Automotives
Communication
Other Applications
Geography North America
Europe
Asia Pacific
Rest of the World
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Substrate Like PCB Market Research FAQs

What is the current Substrate-Like-PCB Market size?

The Substrate-Like-PCB Market is projected to register a CAGR of 12% during the forecast period (2024-2029)

Who are the key players in Substrate-Like-PCB Market?

Kinsus Interconnect Technology Corp., Ibiden Co. Ltd, Compeq Manufacturing Co. Ltd, Daeduck Electronics Co. Ltd and Unimicron Technology Corporation are the major companies operating in the Substrate-Like-PCB Market.

Which is the fastest growing region in Substrate-Like-PCB Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029).

Which region has the biggest share in Substrate-Like-PCB Market?

In 2024, the Asia Pacific accounts for the largest market share in Substrate-Like-PCB Market.

What years does this Substrate-Like-PCB Market cover?

The report covers the Substrate-Like-PCB Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the Substrate-Like-PCB Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029.

Substrate Like PCB Industry Report

Statistics for the 2023 Substrate Like PCB market share, size and revenue growth rate, created by Mordor Intelligence™ Industry Reports. Substrate Like PCB analysis includes a market forecast outlook to 2029 and historical overview. Get a sample of this industry analysis as a free report PDF download.