Substrate-Like-PCB Market Size (2024 - 2029)

Substrate Like PCB Market Analysis

The Substrate-Like-PCB Market is expected to grow at a CAGR of 12% during the forecast period (2022 - 2027). Owing to the rising adoption of substrate-like PCB in OEMs, smart consumer electronics, and wearable devices, there is a growth in the substrate-like PCB market. The need for miniaturization and efficient interconnect solutions is also contributing to substrate-like PCB market growth. At present market is heavily dependent on high-end smartphone growth.

• A PCB substrate is used as a medium between the PCB Board and the rest of the device body without the loss of any power or misfiring of the device. Interconnectors between both units are utilized to efficiently transfer signals to connected components, reducing the total number of connections and, consequently, the total power consumption.
• Smartphone OEMs are increasingly using this SLP technology with a shift toward 5G, which is acting as the main driver for the growth of the market. MediaTek, which offers 5G SoCs, announced a doubled shipment in 2020, announcing that they manufactured nearly 40% of global smartphone SoCs. This indicates the growing demand for 5G devices, which is estimated to fuel the growth of substrate-like PCBs during the forecast period.
• Increasing automobile production and sales and the increased incorporation of advanced safety features, some of which are mandated by government bodies, demand convenience and comfort systems. The growing demand for hybrid electric vehicles (HEV) and battery electric vehicles are the major factors that may drive the market growth during the forecast period.
• Certain challenges will hinder the overall market growth. Factors such as a shortage of skilled labor and the absence of standards and protocols limit the market growth. Furthermore, complicated integrated systems and high-cost setups associated with substrate-like PCB are expected to slow growth during the forecast period.
• With the rising trends in technologies such as IoT, 5G, and smart cars, it is required that the size of the PCB would be miniaturized and the substrates become much more powerful. Thus, substrate-like PCB will be used at a massive scale to support these technological trends.
• Substrate manufacturing has been a massive restraint on the global chip supply chain. The sector's relatively newer origins paired with low margins have forced underinvestment in the market. Moreover, the pandemic forced a severe strain on the existing order of operations, enforced a global chip shortage that constricted personal computer sales, enforced idle plants, and raised costs for electronic devices under lockdown conditions.

Substrate Like PCB Industry Segmentation

Substrate-like-PCB (SLP) is a term that describes the transition of a PCB board into a product with package substrate-like features. Substrate-like-PCB utilizes thin conductors/interconnectors, which efficiently transfer signal and power to all connected components and reduce power consumption. Moreover, substrate-like-PCB are more effective in circuit protection and heat dissipation. Substrate-like-PCB has reached a line and space that is smaller than 30/30 mm, and substrate-like-PCB is a PCB that has feature sizes close to that of an IC substrate. Substrate-like PCB uses an additive etch process and has many applications.

The Substrate-Like-PCB Market is segmented by Application (Consumer Electronics, Automotive, Communication) and Geography.