System in Package Technology Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

System In Package Technology Industry Overview

The system in package technology market is competitive and is dominated by a few major players like Amkor Technology Inc., ASE Group, Samsung Electronics Co Ltd., Toshiba Corporation, and Qualcomm. These major players with a prominent share in the market are focusing on expanding their customer base across foreign countries. These companies are leveraging strategic collaborative initiatives to increase their market share and increase their profitability. However, with technological advancements and product innovations, mid-size to smaller companies are increasing their market presence by securing new contracts and by tapping new markets.

• April 2020 - Fujitsu has received a supercomputer order from Japan Aerospace Exploration Agency. Its new computing system will consist of Fujitsu Supercomputer PRIMEHPC FX1000 with 19.4 petaflops (approximately 5.5 times the theoretical computing performance of the current computing system), in addition to 465 nodes of x86 servers Fujitsu Server PRIMERGY series for general-purpose systems handling diverse computing needs. The new system will be used for conventional numerical simulations, AI computational processing platform for joint research/shared use, and large-scale data analysis platform to aggregate/analyze satellite observation data.
• March 2020 - Toshiba Corporation has launched 80V N-channel power MOSFETs fabricated with the latest generation process. The new MOSFETs are suitable for switching power supplies in industrial equipment used in data centers and communication base stations.The expanded line-up includes "TPH2R408QM," housed in SOP Advance, a surface-mount type packaging, and "TPN19008QM," housed in a TSON Advance package.