Thick Film Devices Industry Overview
The thick film devices market is consolidated due to a significant share of the market is occupied by top players. Moreover, the new player finds it difficult to enter the market due to the strong dominance of existing players. Some of the key players include Panasonic Corporation, Samsung Electronics Co. Ltd, Vishay Intertechnology Inc., TE Connectivity Ltd, KOA Speer Electronics, Inc., and AVX Corporation others.
- April 2020 - Panasonic Corporation introduced NEW ERJ-UP3 Series Anti-Sulfurated Thick Film Chip Resistors, Anti-Surge Type in 0603-inch case size. It is designed to be extremely durable in challenging or unclean, harsh environments. It provides anti-sulfurization characteristics that avoid an open circuit caused by a sulfide disconnection.
- February 2020 - Vishay Intertechnology, Inc. introduced the first high power resistors on the market to be offered with its AEC-Q200 qualified thick film high power resistors. It is designed for direct mounting on a heatsink. The company's Sfernice LPSA range of products delivers high power dissipation and pulse handling capabilities, which in turn helps the designers to reduce component counts and lower costs in automotive applications.
Thick Film Devices Market Leaders
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Panasonic Corporation
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Samsung Electronics Co. Ltd
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TE Connectivity Ltd
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Vishay Intertechnology Inc.
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Rohm Semiconductor GmbH
- *Disclaimer: Major Players sorted in no particular order
