How big is the Thin Wafer Processing and Dicing Equipment Market?

The Thin Wafer Processing and Dicing Equipment Market size is expected to reach USD 728.39 million in 2024 and grow at a CAGR of 6.35% to reach USD 990.95 million by 2029. Read More

What is the current Thin Wafer Processing and Dicing Equipment Market size?

In 2024, the Thin Wafer Processing and Dicing Equipment Market size is expected to reach USD 728.39 million. Read More

Who are the key players in Thin Wafer Processing and Dicing Equipment Market?

Suzhou Delphi Laser Co. Ltd , SPTS Technologies Limited , Plasma-Therm, Han's Laser Technology Industry Group and ASM Laser Separation International (ALSI) BV are the major companies operating in the Thin Wafer Processing and Dicing Equipment Market. Read More

Which is the fastest growing region in Thin Wafer Processing and Dicing Equipment Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2024-2029). Read More

Which region has the biggest share in Thin Wafer Processing and Dicing Equipment Market?

In 2024, the Asia Pacific accounts for the largest market share in Thin Wafer Processing and Dicing Equipment Market. Read More

What years does this Thin Wafer Processing and Dicing Equipment Market cover, and what was the market size in 2023?

In 2023, the Thin Wafer Processing and Dicing Equipment Market size was estimated at USD 684.90 million. The report covers the Thin Wafer Processing and Dicing Equipment Market historical market size for years: 2019, 2020, 2021, 2022 and 2023. The report also forecasts the Thin Wafer Processing and Dicing Equipment Market size for years: 2024, 2025, 2026, 2027, 2028 and 2029. Read More

Thin Wafer Processing & Dicing Equipment Market

Thin Wafer Processing & Dicing Equipment Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)

The report covers Global Wafer Dicing Companies and the market is segmented by Equipment Type (Thinning Equipment, Dicing Equipment (Blade Dicing, Laser Dicing, Stealth Dicing, Plasma Dicing)), By Application (Memory and Logic, MEMS Devices, Power Devices, CMOS Image Sensors, RFID), Wafer Thickness, Wafer Size (Less Than 4 Inch, 5 Inch and 6 Inch, 8 Inch, 12 Inch), and Geography.

Thin Wafer Processing & Dicing Equipment Industry Overview

The market for thin wafer processing and dicing comprises very few major players, such as Disco Corporation, Panasonic Corporation, Nippon, and Pulse Motor Taiwan. Moreover, the market still faces considerable challenges in the manufacturing processes of thin wafers. The above-mentioned factor also led to a slower entry of new players into the market. Nevertheless, constant innovations and R&D efforts by the players in the market maintain a competitive edge. Therefore, competitive rivalry in the market at present is rated moderate.

April 2022 - DISCO Corporation has announced that it has been awarded Intel's EPIC Distinguished Supplier Award. This award distinguishes a consistent level of robust performance across all performance criteria.
January 2022 - Tokyo-based Yokogawa Electric Corporation signed a memorandum of understanding with Aramco for collaboration to explore potential opportunities for localizing semiconductor chip manufacturing in the Kingdom of Saudi Arabia.