Market Share of Thin Wafer Processing and Dicing Equipment Industry
The market for thin wafer processing and dicing comprises very few major players, such as Disco Corporation, Panasonic Corporation, Nippon, and Pulse Motor Taiwan. Moreover, the market still faces considerable challenges in the manufacturing processes of thin wafers. The above-mentioned factor also led to a slower entry of new players into the market. Nevertheless, constant innovations and R&D efforts by the players in the market maintain a competitive edge. Therefore, competitive rivalry in the market at present is rated moderate.
- April 2022 - DISCO Corporation has announced that it has been awarded Intel's EPIC Distinguished Supplier Award. This award distinguishes a consistent level of robust performance across all performance criteria.
- January 2022 - Tokyo-based Yokogawa Electric Corporation signed a memorandum of understanding with Aramco for collaboration to explore potential opportunities for localizing semiconductor chip manufacturing in the Kingdom of Saudi Arabia.
Thin Wafer Processing & Dicing Equipment Market Leaders
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Suzhou Delphi Laser Co. Ltd
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SPTS Technologies Limited
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Plasma-Therm
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Han's Laser Technology Industry Group
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ASM Laser Separation International (ALSI) BV
*Disclaimer: Major Players sorted in no particular order
