Market Share of UAV Payload and Subsystems Industry
The UAV payload and subsystems market is characterized by the presence of limited dominant vendors operating at a global level. The market is highly competitive, with players competing to gain the largest market share. Some of the major players in the UAV payload and subsystems market are AeroVironment Inc., Elbit Systems Ltd., Lockheed Martin Corporation, SZ DJI Technology Co., Ltd., and Teledyne Technologies Incorporated amongst others. It is now becoming crucial for vendors to provide state-of-the-art systems to OEMs to survive and succeed in an intensely competitive market environment.
In this regard, in March 2021, Elbit Systems introduced the new variant of its Advanced Multi-Sensor Payload System (AMPS NG) for UAVs, which introduces Shortwave Infrared (SWIR) technology to the existing CCD (Charge-Coupled Device) TV sensors with a unique dual FLIR sensor design. Similarly, another company, Aerovironmenthas introduced its new imaging payload in the MANTIS range of payloads, the MANTIS i23 D multi-sensor payload. This new payload is compatible with Raven B small Unmanned Aircraft System (SUAS) and has an ultralight imaging system with dual 18 MP electro-optical sensors and 24X digital zoom. The majority of the defense OEMs integrate advanced sensors and other supporting subsystems aboard their UAV offerings to minimize R&D costs pertaining to the cross-integration of communication platforms.
Hence, vendors mainly compete on their in-house manufacturing capabilities, global footprint network, product offerings, R&D investments, and strong client base. The competitive environment in the market is likely to intensify further due to an increase in product/service extensions and technological innovations.
UAV Payload and Subsystems Market Leaders
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AeroVironment Inc.
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Elbit Systems Ltd.
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Lockheed Martin Corporation
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SZ DJI Technology Co., Ltd.
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Teledyne Technologies Incorporated
*Disclaimer: Major Players sorted in no particular order
